Photomicrograph Database

Artifact ID BC 0621/0676
Negative Number NS109
Magnification 200x
Etchant AH/HP, FeCl3
Photo Date 7/7/2000

Photomicrograph Description

Twinned copper grains redeposited in voids as a result of corrosion.





Metallographic Description

Large, slightly cored dendrites, with a great deal of eutectoid still remaining, though it has been preferentially attacked by corrosion. This suggests that the alloy was fairly high in tin and cooled rather slowly. Twinned redeposited copper has filled some voids.

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